IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

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The conference brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies.

IMAPS Nordic Conference on Microelectronics Packaging (NordPac) is technically sponsored by IEEE. The conference proceedings are likely to be indexed in databases such as Scopus, Web of Science (WoS), Google Scholar, and others.

 

Date

10 Jun. 2025
12 Jun. 2025
 

City

Copenhagen
 

Country

 

Topic Area

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