Advanced materials and processing technologies, power semiconductor technologies and circuits; Advanced transistor and interconnect structures; Advanced packaging, heterogenous integration, lateral and vertical (2.5D/3D) integration; Variation and fault-tolerant designs, reliability issues and mitigation approaches, EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability; RF, analog, mixed signal, and I/O circuits for future technology generations; Simulation and modeling of advanced processes, devices, and circuits; Design for manufacturing, yield, and test, System-on-Chip (SoC) and System-in-Package (SiP) design integration; Emerging technologies, circuits and applications (MEMS, Memory, Internet of Things, Autonomous cars, Machine Learning, Artificial Intelligence).

IEEE International Conference on IC Design and Technology (ICICDT) is technically sponsored by IEEE.