IEEE Build-Up Substrate Symposium (BUSS)
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Build-Up substrates are integral to high performance and leading edge IC devices requiring heterogenous integration of many chips onto 1 platform made of build-up substrate. This conference focuses on new technologies, new architectures, supply chain and manufacturing of build-Up substrates in USA.
IEEE Build-Up Substrate Symposium (BUSS) is technically sponsored by IEEE. The proceedings of this conference are likely to be indexed in renowned databases such as Scopus, Web of Science (WoS), Google Scholar, and many others.