26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2025)
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The 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2025) will be held in Utrecht, Netherlands.
The event invites contributions from all research domains related to the following areas: Thermal, Mechanical, Multiphysics, Micro/Nano-Electronics.
Please be reminded that the deadline for submitting your contribution is Nov 04, 2024.