The 31st edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2024) will beheld in-person at the iconic Marina Bay Sands Exhibition and Convention Centre, Singapore from 15 – 18 July 2024. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies. These assist in probing the nature of wear-out and failure in conventional and new electron devices. Outcomes of such analysis is critical in improving knowhow of the physics of device / circuit / module failure that in turns serves as a main input for future design for reliability. We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of FA and Reliability.