The aim of the conference is to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include design, test and technology of electronic products, ranging from integrated circuit modules, chiplets and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products. DTTIS will show innovations in system and platform design, which extend beyond a single integrated circuit. These platforms may include 2.5D/3D chiplet based system-in-package, system-on-interposer, and multi-die integrations. It will be an opportunity for researchers to present and discuss their latest work. DTTIS is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, test, technology, and process experts together.